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Method for a low-profile SCSP through shared interconnects

IP.com Disclosure Number: IPCOM000012935D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 927K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a low-profile stack chip scale package (SCSP) through shared interconnects. Benefits include improved functionality and improved cost effectiveness.

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Method for a low-profile SCSP through shared interconnects

Disclosed is a method for a low-profile stack chip scale package (SCSP) through shared interconnects. Benefits include improved functionality and improved cost effectiveness.

Background

        � � � � � The trend toward smaller and cheaper devices leads to requirements to reduce overall package height and reduce costs. Conventional SCSPs contain gold wire material, which is expensive.

        � � � � � Conventionally, the wire-bond process is used as an interconnect for die stacking. Wire-bond loops contribute to the overall package height. As the number of stacked dice increases, the wire-bond process increases at a 1:1 ratio of 1 wire-bond process per die. The wire-bond process becomes more complicated as the number of dice stacking increases. The cost of the wire bond also increases as the number of dice stacked is increased (see Figure 1).

General description

        � � � � � The disclosed method stacks more dice with less package height increase through shared interconnects. The method uses less wire-bond processing than the conventional solution.

        � � � � � The key elements of the method include:

•        � � � � Reduced wire-bond process in the shared-bond process configuration

•        � � � � Use of the bump-bond process

•        � � � � Dice stacked as pairs of mirror dice or pairs of dice with pads routed through a shared distribution layer

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved functionality due to providing a low-profile SCSP

•        � � � � Improved functionality due to� the sharing of one interconnect by two dice

•        � � � � I...