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Method for consistent slurry delivery for CMP systems

IP.com Disclosure Number: IPCOM000012942D
Publication Date: 2003-Jun-11
Document File: 2 page(s) / 29K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for consistent slurry delivery for chemical mechanical polishing (CMP) systems. Benefits include improved performance.

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Method for consistent slurry delivery for CMP systems

Disclosed is a method for consistent slurry delivery for chemical mechanical polishing (CMP) systems. Benefits include improved performance.

Background

        � � � � � Inconsistent slurry delivery or quality to CMP tools is one of the leading causes for polishing problems. Micro scratches can occur because of changes in the colloidal suspension (slurry particle agglomeration). Polishing rates and uniformity can be affected by changes in slurry chemistry. In conventional slurry delivery systems, the slurry remains stagnant in the line when wafers are not being polished. Each wafer is not treated with the same slurry quality as the others. This variation leads to differences in polish quality.

        � � � � � Conventionally, the slurry is delivered to the system using pumps, which control the flow rate. A valve shuts off flow to the CMP tool when wafers are not being polished.

General description

        � � � � � The disclosed method delivers slurry to CMP systems. This delivery system solves the problems with slurry aging, particulate agglomeration, and chemical changes in the slurry.

        � � � � � The disclosed method is a slurry delivery system that keeps the slurry in continuous motion and prevents stagnation (see Figure 1). Most of the issues with slurry aging, alteration of chemistry and agglomeration of particles occur because the slurry remains stagnant in the line when wafers are not being polished on the CMP tool. Particle agglomeration or changes in particle suspens...