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Method for multilayer electronic package molding and tooling

IP.com Disclosure Number: IPCOM000012947D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 85K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multilayer electronic package molding and tooling. Benefits include improved yield, and lower manufacturing cost.

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Method for multilayer electronic package molding and tooling

Disclosed is a method for multilayer electronic package molding and tooling. Benefits include improved yield, and lower manufacturing cost.

Background

� � � � � The molding step is a process bottleneck and the most costly packaging step. Conventional processing is performed with a single-layer mold tooling (single or double sided) that has limited output. The conventional solution for capacity increase is to increase the number of molding machines, which is very costly.

        � � � � � The conventional process includes the following steps (see Figure 1):

1.        � � Load the object.

2.        � � Close the tool.

3.        � � Add the mold compound pallet.

4.        � � Plunge the mold compound pallet.

5.        � � Open the tool.

6.        � � Separate and degate.

General description

        � � � � � The disclosed method is electronic package molding utilizing multiple layers of mold tooling to achieve multiple output from a single shot of molding. The key element of the method includes multiple layers of mold tooling plates with a guide bar to complete the molding process.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved yield due to increased uniformity and the number of packages molded in one molding cycle.

•        � � � � Improved cost effectiveness due to increasing the existing molding machine capacity rather than purchasing additional machines for capacity expansions.

Detailed description

        � � � � � The disclosed method...