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Method for multilayer electronic package molding and tooling

IP.com Disclosure Number: IPCOM000012947D
Publication Date: 2003-Jun-11
Document File: 3 page(s) / 73K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for multilayer electronic package molding and tooling. Benefits include improved yield, and lower manufacturing cost.

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Method for multilayer electronic package molding and tooling

Disclosed is a method for multilayer electronic package molding and tooling. Benefits include improved yield, and lower manufacturing cost.

Background

      The molding step is a process bottleneck and the most costly packaging step. Conventional processing is performed with a single-layer mold tooling (single or double sided) that has limited output. The conventional solution for capacity increase is to increase the number of molding machines, which is very costly.

              The conventional process includes the following steps (see Figure 1):

1.           Load the object.

2.           Close the tool.

3.           Add the mold compound pallet.

4.           Plunge the mold compound pallet.

5.           Open the tool.

6.           Separate and degate.

General description

              The disclosed method is electronic package molding utilizing multiple layers of mold tooling to achieve multiple output from a single shot of molding. The key element of the method includes multiple layers of mold tooling plates with a guide bar to complete the molding process.

Advantages

              The disclosed method provides advantages, including:

•             Improved yield due to increased uniformity and the number of packages molded in one molding cycle.

•             Improved cost effectiveness due to increasing the existing molding machine capacity rather than purchasing additional machines for capacity expansions.

Detailed description

              The disclosed method...