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Method and Apparatus of Attaching a Stiffener to a Flexible Laminate

IP.com Disclosure Number: IPCOM000012952D
Original Publication Date: 2000-Nov-01
Included in the Prior Art Database: 2003-Jun-11
Document File: 1 page(s) / 46K

Publishing Venue

IBM

Abstract

Method and Apparatus of Attaching a Stiffener to a Flexible Laminate

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Method and Apparatus of Attaching a Stiffener to a Flexible Laminate

Method and Apparatus of Attaching a Stiffener to a Flexible Laminate

Disclosed is a method and apparatus to assemble a chip carrier to a stiffener in an Autoclave. Figure 1 is a cross section of a chip carrier in an Autoclave. The frame (6) is placed on the planer mounting base (1). The chip carrier (2), dry film (3) and stiffener (4) are placed inside the opening of the frame. The frame material CTE (aproximately 18 PPM per degree C) is greater than that of the chip carrier assembly (approximately 10 PPM per degree C). A thin teflon sheet is placed between the chip carrier assemblies and the flexible vacuum member (5). Vacuum is drawn between the mounting base and the flexible top sheet to clamp all items in the Z axis. High pressure and heat are added in the Autoclave to bond the chip carrier to the stiffener by the dry film adhesive.

Figure 1

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