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NON-DESTRUCTIVE DEBUG AND ENGINEERING CHANGE APPARATUS

IP.com Disclosure Number: IPCOM000013005D
Original Publication Date: 2000-Jun-01
Included in the Prior Art Database: 2003-Jun-12
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Abstract

Complex circuit packages such as those which use dendrite contacts to connect with complex circuit boards are inherently difficult to debug and to make circuit alterations for test purposes. Many surface mount contacts are clustered and sometimes arrayed in close proximity to one another making it nearly impossible to fan out the signals for probing or for circuit additions or alterations. These complex circuit packages may test fine in a tester but when applied to their actual load environment the packages may fail. The pins that need to be accessed and probed to debug the circuit deficiencies or failures may be inaccessible when the circuit package is in place on the board. Also, if E.C.'s have to be made to the complex circuit board it can be very expensive.

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NON-DESTRUCTIVE DEBUG AND ENGINEERING CHANGE APPARATUS

   Complex circuit packages such as those which use dendrite contacts to connect with complex circuit boards are inherently difficult to debug and to make circuit alterations for test purposes. Many surface mount contacts are clustered and sometimes arrayed in close proximity to one another making it nearly impossible to fan out the signals for probing or for circuit additions or alterations. These complex circuit packages may test fine in a tester but when applied to their actual load environment the packages may fail. The pins that need to be accessed and probed to debug the circuit deficiencies or failures may be inaccessible when the circuit package is in place on the board. Also, if E.C.'s have to be made to the complex circuit board it can be very expensive.

Thin insulating material such as flex circuit material can be designed such that it is placed between the circuit package and the circuit board. This material can have dendrites on its bottom side to connect to the circuit board pads and it can have corresponding pads on the top to connect to the dendrites which are on the bottom of the complex circuit package. Further, this thin insulating material can have via holes within it to connect the dendrite on the bottom of the material to the pad on the top of the material. This would provide a straight-thru path for the signal to pass from the complex circuit board to the complex circuit package. Alternatively, the insulating material can leave the insulation intact between the bottom dendrite and the top pad, leaving an open circuit between the complex circuit board and the complex circuit package. Both approaches are useful when debugging complex circuit packages.

The thin insul...