Browse Prior Art Database

Shared Power Distribution Thermal Protection

IP.com Disclosure Number: IPCOM000013072D
Original Publication Date: 2000-Mar-01
Included in the Prior Art Database: 2003-Jun-12
Document File: 4 page(s) / 242K

Publishing Venue

IBM

Abstract

Disclosed is a device which will protect a system and allow limited operation when upper thermal limits are being exceeded and the cooling system is unable to maintain proper temperatures. This invention will also protect some individual components from damage when their local environment cannot be maintained in an acceptable range.

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Shared Power Distribution Thermal Protection

  Disclosed is a device which will protect a system and allow limited operation when upper thermal limits are being exceeded and the cooling system is unable to maintain proper temperatures. This invention will also protect some individual components from damage when their local environment cannot be maintained in an acceptable range.

Claims

1. Protects a system or components of a system from damage due to high temperatures
2. Allows a system to run with reduced capacity rather than fail or turn off

Description

Figure 1 The Invention

1

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Figure 2 The Preferred Embodiment

Many computers are used to run businesses and make critical calculations. It is imperative that the reliability and correct operation of these systems be preserved. This invention makes improvements in these areas.

The important features of Figure 1 are:

  1 - interface signals A - interface logic to the system via processor, maintenance processors etc.

B1, B2 .. Bn - processors or other components C - isolation buffer to reduce the load on circuit 2 and

2

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to remove power to all D(i) together

  D1, D2 .. Dn - power producing components E1, E2 .. En - isolation control gates to remove power of the D(i) individually or in groups.

  Th1, Th2 .. Thn - thermal sensors integrated into components B(i) or in close thermal proximity

  The (i) - thermal sensors for the environment affecting the components

  Vd1, Vd2 .. Vdn - various voltages output by D1, D2 .. Dn and input to components B1, B2 .. Bn

  Vb1r1, Vb1r2 .. Vb1rn - various encoded voltage requirements for component 1

  Vb2r1, Vb2r2 .. Vb2rn - various encoded voltage requirements for component 2

  Vbnr1, Vbnr2 .. Vbnrn - various encoded voltage requirements for component n

Note: Some of the signals are not discussed here nor are they required.

It is important to note that multiple groups as shown in Figure 1 are allowed. For the discussion which follows, it will be assumed that there are two separate instantiations of this invention in one system. The first will be referred to as group X and the second as group Y.

The invention consists of the ability to monitor one or more components thermally The (i) as well as monitor the environment The (i) at various locations. These thermal sensors can be integrated into the components B(i) or be in close thermal proximity. When the system can no longer be properly cooled and temperatures reach a critical level, power can be removed from...