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Method of Laminate Plating Different Chemistries in a Single Plating Module

IP.com Disclosure Number: IPCOM000013256D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-18
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Bob Hitzfeld: AUTHOR [+4]

Abstract

The ability to plate laminate structures will decrease/eliminate eddy currents in the pole tip, eliminate the need to ion mill the pole tip as done today. This method will allow two different chemistries to plate on a wafer, building up a structure of infinite alternating layers and thicknesses.

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Method of Laminate Plating Different Chemistries in a Single Plating Module

   The ability to plate laminate structures will decrease/eliminate eddy currents in the pole tip, eliminate the need to ion mill the pole tip as done today. This method will allow two different chemistries to plate on a wafer, building up a structure of infinite alternating layers and thicknesses.

   The plating module comprises two or more plating baths having different chemistries. The system has the ability to transfer the cathode and canode assy. between the two plating cells and the rinse tank in any combination. A computer would control the laminate layers for plated thicknesses, rinse, etc. With computer control, the system could plate at different current densities and rates, as required by the particular chemistry. Adding a spray nozzle to the cathode/anode assembly will allow various chemicals to be applied to the wafer above the rinse tank, permitting oxide layers to be formed as an example, in the laminate structure.

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