Browse Prior Art Database

Single Point Anchoring Retention Features for P4 CPU (Pentium 4 Central Processing Unit)

IP.com Disclosure Number: IPCOM000013311D
Original Publication Date: 2001-Oct-23
Included in the Prior Art Database: 2003-Jun-18
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Abstract

The invention described here is for anchoring a planar with a P4 CPU or similar to the chassis in which it is mounted. The problem is that the next generation of CPUs have heavy heat sinks which require expensive packaging to protect the CPU to planar integrity in shipping. The heavy heat sinks tend to tear loose of the MB (Motherboard) in fragility and packaged test used to simulate the shipping environment. In order to reduce the stress on the MB and the cost of packaging a mechanical solution is proposed by this disclosure. The proposed solution consist of a hook spaced off the bottom of the planar that engages in a loop on the chassis enclosure. Shown is a planar with attached P4 and heat sink, top view: (see JPG figure P4planarwproccesor). Next is the hook portion of the disclosed invention as mounted to the back of the planar, see JPG figure P4planarbackwbrkt.jpg.). This consist of a spacer to space away from the components at the planar bottom and a metal hook part made from stamped sheet metal. see the following for the two individual pieces, see JPG figure P4brktwspacersidebyside.jpg) and together before attachment to the planar, (see JPG figure P4brktwspacerontop) , or see the following for the production version (see JPG figure assembly.jpg), and as mounted on the bottom of the planar, (see JPG figure P4planarbackwbrkt.jpg).

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  Single Point Anchoring Retention Features for P4 CPU (Pentium 4 Central Processing Unit)

The invention described here is for anchoring a planar with a P4 CPU or similar to the chassis in which it is mounted. The problem is that the next generation of CPUs have heavy heat sinks which require expensive packaging to protect the CPU to planar integrity in shipping. The heavy heat sinks tend to tear loose of the MB (Motherboard) in fragility and packaged test used to simulate the shipping environment. In order to reduce the stress on the MB and the cost of packaging a mechanical solution is proposed by this disclosure. The proposed solution consist of a hook spaced off the bottom of the planar that engages in a loop on the chassis enclosure. Shown is a planar with attached P4 and heat sink, top view: (see JPG figure P4planarwproccesor). Next is the hook portion of the disclosed invention as mounted to the back of the planar, ( see JPG figure P4planarbackwbrkt.jpg.). This consist of a spacer to space away from the components at the planar bottom and a metal hook part made from stamped sheet metal. see the following for the two individual pieces, ( see JPG figure P4brktwspacersidebyside.jpg) and together before attachment to the planar, (see JPG figure P4brktwspacerontop) , or see the following for the production version (see JPG figure assembly.jpg), and as mounted on the bottom of the planar, (see JPG figure P4planarbackwbrkt.jpg).

     Mounting is done through the benches that the heatsink sits on at the board's top side. This bracket is planned to be the same for all P4 product line with same heatsink type and is adaptable to all diverging heat sink types as well. The concept works for all planar P4 combinations that have planar board through holes to clamp the heatsink benches. The heatsink benches and the corresponding holes to mount them are in support of the heatsink to the planar top. This is insufficient to keep the heatsink from da...