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Impinging Heat Sink with flow-through passages for Cooling Multi-Component Modules

IP.com Disclosure Number: IPCOM000013376D
Original Publication Date: 2002-May-21
Included in the Prior Art Database: 2003-Jun-18
Document File: 3 page(s) / 89K

Publishing Venue

IBM

Abstract

The relentless quest for higher performance and lower cost digital electronics is resulting in the formation of multi-component modules: silicon chips and single chip (predominantly memory) modules mounted onto a single electronics package/substrate. Figure 1. shows a top view of such a module. The components on the package most always differ in component height and power dissipation. Components heights can vary by as much as 1.5 mm (0.060 inches). The silicon chip (i.e. ASIC) is typically a processor function dissipating heat on the order of ten or more watts; the single chip modules are typically memory modules dissipating heat between a few tenths of a watt up to two watts. SDRAM Space for Decaps Z 0.98 mm for 100 nf 22.22 mm X 10.16 mm

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  Impinging Heat Sink with flow-through passages for Cooling Multi-Component Modules

       The relentless quest for higher performance and lower cost digital electronics is resulting in the formation of multi-component modules: silicon chips and single chip (predominantly memory) modules mounted onto a single electronics package/substrate. Figure 1. shows a top view of such a module. The components on the package most always differ in component height and power dissipation. Components heights can vary by as much as 1.5 mm (0.060 inches). The silicon chip (i.e. ASIC) is typically a processor function dissipating heat on the order of ten or more watts; the single chip modules are typically memory modules dissipating heat between a few tenths of a watt up to two watts.

SDRAM

  Space for Decaps Z = 0.98 mm for 100 nf

22.22 mm X 10.16 mm
0.3 watts Z = 1.27 mm

22.22 mm X 10.16 mm
0.3 watts Z = 1.27 mm

ASIC

15.0 mm X 15.0 mm 16 watts Z = 0.83 mm

SDRAM

  Space for Decaps Z = 0.98 mm for 100 nf

SRAM

22 mm X 14 mm 1.52 watts Z = 2.41 mm

42.5 CCGA Module

Figure 1. Example of a Multi-Component Module

  Additionally, conventional module capping is impossible because there is not enough free area out at the periphery of the substrate to joint the cap to. This problem has been addressed for single chip modules by attaching a heat sink directly to the chip; a process called Direct Lid Attach, or DLA. Attaching a heat sink to multiple components on a module simultaneously becomes difficult (i.e. costly) to implement because good thermal interfaces now have to made on all components forcing the base of the heat sink to have multiple surfaces of varying depths to conform to the component height variation on the module. Furthermore, thermally induced stresses are more problematic when a single structure is attached to the multiple components.

  Disclosed herein is...