Browse Prior Art Database

Foot print design for EP Package

IP.com Disclosure Number: IPCOM000013423D
Original Publication Date: 2002-Feb-01
Included in the Prior Art Database: 2003-Jun-18
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Abstract

1. ABSTRACT Disclosed is the card physical design method to make it easy to confirm solderbility between heat sink and raw card. 2. INVENTION This invention is foot print design on raw card for heat sink E xposed Paddle package (Refer FIG-1).

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Foot print design for EP Package

   1. ABSTRACT
Disclosed is the card physical design method to make it easy to
confirm solderbility between heat sink and raw card.
2. INVENTION
This invention is foot print design on raw card for heat sink E
xposed Paddle package
(Refer FIG-1).

As shown in FIG-2, monitor area is specially designed which is
isolated from the heat sink area
on foot print.

One or more monitor area are prepared on raw card, then
Monitoring conductivity of point1 and 2 (refer FIG-3) makes it
is possible to check solder attachment ration without visual
inspection.

Exposed paddle package

FIG-1

HEAT SINK

PA C KA G E M O LD

HEAT SINK AREA

M O NITO R AREA

FO O T P RINT on Raw card

FIG-2

A

CO NFIRM SO LDERBILITY

FIG -3

1 2

1

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