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Method for an improved BGA PCB footprint design for increased density

IP.com Disclosure Number: IPCOM000013535D
Publication Date: 2003-Jun-18
Document File: 3 page(s) / 45K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an improved ball-grid array (BGA) printed circuit board (PCB) footprint design for increased density. Benefits include improved performance and improved support for emerging technologies.

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Method for an improved BGA PCB footprint design for increased density

Disclosed is a method for an improved ball-grid array (BGA) printed circuit board (PCB) footprint design for increased density. Benefits include improved performance and improved support for emerging technologies.

Background

        � � � � � Conventionally, all BGA PCB footprints are designed using the same BGA pad diameter (see Figure 1). This practice limits (mathematically) the number of routing channels that can be designed using a specific trace/space requirement.

Description

        � � � � � The disclosed method is improved BGA PCB footprint design for increased density. The outermost rows of the BGA component are reduced in diameter (see Figure 2). The routing channels/paths are enlarged to enable improved breakout from the component (such as reduced layers).

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to reduced layer count

•        � � � � Improved support for emerging technologies due to reduced package size

•        � � � � Improved cost effectiveness due to improved utilization of the silicon surface area

Fig. 1

Fig. 2

Disclosed anonymously