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Method for an improved BGA PCB footprint design for increased density

IP.com Disclosure Number: IPCOM000013535D
Publication Date: 2003-Jun-18
Document File: 3 page(s) / 113K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an improved ball-grid array (BGA) printed circuit board (PCB) footprint design for increased density. Benefits include improved performance and improved support for emerging technologies.

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Method for an improved BGA PCB footprint design for increased density

Disclosed is a method for an improved ball-grid array (BGA) printed circuit board (PCB) footprint design for increased density. Benefits include improved performance and improved support for emerging technologies.

Background

              Conventionally, all BGA PCB footprints are designed using the same BGA pad diameter (see Figure 1). This practice limits (mathematically) the number of routing channels that can be designed using a specific trace/space requirement.

Description

              The disclosed method is improved BGA PCB footprint design for increased density. The outermost rows of the BGA component are reduced in diameter (see Figure 2). The routing channels/paths are enlarged to enable improved breakout from the component (such as reduced layers).

Advantages

              The disclosed method provides advantages, including:

•             Improved performance due to reduced layer count

•             Improved support for emerging technologies due to reduced package size

•             Improved cost effectiveness due to improved utilization of the silicon surface area

Fig. 1

Fig. 2

Disclosed anonymously