Browse Prior Art Database

Peripheral Barriered Bump Construction

IP.com Disclosure Number: IPCOM000013590D
Original Publication Date: 2000-Aug-01
Included in the Prior Art Database: 2003-Jun-18
Document File: 1 page(s) / 56K

Publishing Venue

IBM

Abstract

This invention is to enhance the solder joint reliability for flip-chip technology by means of having barrier metal such as Cr, Ni above solder wettable metal layer such as copper at perimeter of BLM(Ball Limiting Metallurgy) , as shown in Figure 1 and figure 2. This barrier metal is to work to protect any occurrence of boundary separation between adhesion metal layer such as Cr and solder wettable metal layer.

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Peripheral Barriered Bump Construction

    This invention is to enhance the solder joint reliability for flip-chip technology by means of
having barrier metal such as Cr, Ni above solder wettable metal layer such as copper at perimeter of
BLM(Ball Limiting Metallurgy) , as shown in Figure 1 and figure 2. This barrier metal is to work
to protect any occurrence of boundary separation between adhesion metal layer such as Cr and solder
wettable metal layer.

          In general, solder volume is strictly controlled for flip-chip joining to avoid a
boundary separation, especially in the case of higher Sn-content solder such as 63Sn-37Pb solder. By
the application of the invented bump construction, its solder volume does not have to be controlled
precisely.

.

Solder Wettable Metal(Ex.Cu)

Solder(Ex.. .Sn-Pb)

B um p barrier m etal(Ex. C r, N i)

Adhesion Metal(Ex. Cr)

Polyimide

Nitride

Al

Oxide

fig. 1

Solder Wettable Metal(Ex.Cu)

Bump Barrier Metal  (Ex. Cr, Ni)

Diffusion Barrier Metal(Ex.Ni)

Adhesion Metal(Ex. Cr)

Polyimide

Nitride

Al

ediOxsubstrate(Si)

fig. 2

1

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