Browse Prior Art Database

Holding method for electronic devices by top cover or panel

IP.com Disclosure Number: IPCOM000013701D
Original Publication Date: 2001-Mar-01
Included in the Prior Art Database: 2003-Jun-18
Document File: 3 page(s) / 60K

Publishing Venue

IBM

Abstract

Disclosed is a packaging method to hold electronic devices such

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Holding method for electronic devices by top cover or panel

  Disclosed is a packaging method to hold electronic devices such
as ; Printed circuit cards/boards, electronic devices and
semiconductors by top cover. This packaging method can prevent
defects caused by electrostatic discharge and physical damages by
shock and vibration during transportation including material
handling. Top cover tightly holds upper part of all electronic
devices in a shipping box. Conductive or antistatic urethane sheet
or forming material are used for top cover. ( Surface Resistance :
10* 6-13 ohm ) Refer to figure 1.

       Most conventional packaging method for electronic devices
is to use anti electrostatic discharge bags for each devices or to
hold electronic devices individually by antistatic sheets or
cushioning materials. Refer to figure 1.

       However, Disclosed packaging method does not need to use
anti electrostatic discharge bags or materials for electronic
devices to
prevent defects during transportation including material handling.
In addition, this method eliminates packing operation tact time to
insert
and to pull out each electronic device into antistatic discharge
bags or materials. Refer to figure 2.

       Charged electrostatic voltages on circuit cards were
measured for disclosed and conventional method to verify anti
electrostatic discharge effectiveness of top cover after random
vibration test was performed. Charged electrostatic voltage value
of disclosed method is same level as conventional method. Refer to
table 1. In addition, function test and visual inspection were
performed...