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DESIGN SCHEME OF SELECTED PAD ROUTING FOR SIDE RAIL SLIDERS

IP.com Disclosure Number: IPCOM000013738D
Original Publication Date: 1999-Dec-01
Included in the Prior Art Database: 2003-Jun-18
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

HP LEE: AUTHOR [+3]

Abstract

For side rail slider design, film head is located on tone side of the slider. The location of the head (left or right side is determined by whether the head is used on the top or bottom of the disk. It is much simpler to make these heads in manufacturing if one can build both top and bottom heads on the same slider at the wafer level. Since each MR (or GMR) heads requires 4 bonding pads (i.e., 2 for read head and 2 for write head), the pad size for 8 bonding pads in one slider will be very small. Disclosed is a design of pad routing for side rail sliders so that the same set of pads can be used for either the left head or the right head for recording head application.

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DESIGN SCHEME OF SELECTED PAD ROUTING FOR SIDE RAIL SLIDERS

For side rail slider design, film head is located on tone side of the slider. The location of the head (left or right side ) is determined by whether the head is used on the top or bottom of the disk. It is much simpler to make these heads in manufacturing if one can build both top and bottom heads on the same slider at the wafer level. Since each MR (or GMR) heads requires 4 bonding pads (i.e., 2 for read head and 2 for write head), the pad size for 8 bonding pads in one slider will be very small. Disclosed is a design of pad routing for side rail sliders so that the same set of pads can be used for either the left head or the right head for recording head application.

For the side rail design, both left and right heads in a slider can be built at the same time. However, instead of having the read and write head leads connected to the bonding pads directly, all the leads are terminated to 8 smaller pads. Pads A, B, C, D are for the left head, and pads A', B', C', D' for the right head (see Figure 1). The arrangement of the small pads is done to achieve the routing convenience. The underground layer is designed to suit the routing. The detail teaching of the underground routing design for different pad orientation is described in US patent number 5,486,968. Figure 1 is an example of pad and lead routing layout. The bonding pad connection is done at the later stage of the process at which the selection of...