Browse Prior Art Database

Virtual Mirror and Virtual Mirror Cross Over on Package Decoupling

IP.com Disclosure Number: IPCOM000013942D
Original Publication Date: 2000-Mar-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 4 page(s) / 88K

Publishing Venue

IBM

Abstract

Disclosed is a device that allows components such as processors, caches, host bridges, memory etc. to be close together. This closeness will allow the busses connecting these components to operate at higher frequencies or with more timing margins and the systems they are in to become smaller in size. This device is especially useful for the “Virtual Mirror Package” referred to as VMP and the “Virtual Mirror Cross Over Package” referred to as VMCOP which have patent applications pending. Typical computer systems have integrated circuit components separated from each other by distance with decoupling capacitors at each location. One restraint in bringing the components closer together is the need to decouple each component. Currently this decoupling is placed around the perimeter of the components or underneath the components. The preferred embodiment discussed for this invention is VMCOP and will be discussed first. Figure 1 Virtual Mirror Cross Over Package (VMCOP)

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Virtual Mirror and Virtual Mirror Cross Over on Package Decoupling

Disclosed is a device that allows components such as processors, caches, host bridges, memory etc. to be close together. This closeness will allow the busses connecting these components to operate at higher frequencies or with more timing margins and the systems they are in to become smaller in size. This device is especially useful for the "Virtual Mirror Package" referred to as VMP and the "Virtual Mirror Cross Over Package" referred to as VMCOP which have patent applications pending.

Typical computer systems have integrated circuit components separated from each other by distance with decoupling capacitors at each location. One restraint in bringing the components closer together is the need to decouple each component. Currently this decoupling is placed around the perimeter of the components or underneath the components. The preferred embodiment discussed for this
invention is VMCOP and will be discussed first.

Figure 1 Virtual Mirror Cross Over Package (VMCOP)

Note: Lower layers (closer to the mother board) are solid planes where the routing through the package allows crossing the busses over side to side.

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Figure 2 Above the cross over wiring solid planes is the layer for bonding out the silicon to the vias over the balls.

Figure 3 The upper layer of the package will contain islands of power and ground planes across which all of the local power decoupling can be
placed.

Claims

1. Smaller systems composed of multiple groups or clusters
2. Greater flexibility of component placement
3. Faster speeds.
4. Shorter traces.
5. Simplified wiring.
6. Reduced cost of mother board
7. Fewer passive components required

Description

This invention allows VMP and VMCOP to achieve optimized benefits by letting the packages approach zero spacing in systems with many components. This invention is not limited to use with VMP and VMCOP components but can improve decoupling in systems using components not fully compliant with the VMP and VMCOP innovations.

The VMP and VMCOP inventions consist of multiple layers. Figure 1 shows the lower layers which are solid planes for wiring up the cross over busses. Figure 2 shows the layer with the Si bond out. Figure 3 shows the upper layers where the decoupling capacitors are placed. These

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packages can support multiple voltages and this top plane can have multiple power planes and a ground plane. Across the appropriate islands capacitors can be placed for decoupling.

Capacitive decoupling is effective only for very short distances. State of the Art puts capacitors around the perimeter of chips or on the under side of a chip away from the pins. Both of these must be at a distance away from the pins required by manufacturing tolerances. Also current art places components away from each other on the same side of...