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Browse Prior Art Database

SIMPLE GMR HEAD THERMAL STABILITY IMPROVEMENT

IP.com Disclosure Number: IPCOM000014060D
Original Publication Date: 1999-Dec-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Harry Gill: AUTHOR

Abstract

Simple GMR head has the following structure Seed layer/FREE layer/Cu spacer/PINNED layer/Antiferromagnet/Cap layer The current flow through the structure is such that field from the current opposes the pinned magnetization of the pinned layer. At elevated temperature, the pinned layer begins to rotate due to destabilizing impact of the field from the current . The field from the current acting on the pinned layer can be reduced to zero by selecting pinned layer location within the gap such that it is three times farther from shield 1 than from shield 2. Since the field from current acting on the FREE layer will also change by this offset of the sensor, pinned layer thickness will require proper optimization to obtain near zero signal for read head for magnetic recording application. 1

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SIMPLE GMR HEAD THERMAL STABILITY IMPROVEMENT

Simple GMR head has the following structure

Seed layer/FREE layer/Cu spacer/PINNED layer/Antiferromagnet/Cap layer

     The current flow through the structure is such that field from the current opposes the pinned magnetization of the pinned layer. At elevated temperature, the pinned layer begins to rotate due to destabilizing impact of the field from the current . The field from the current acting on the pinned layer can be reduced to zero by selecting pinned layer location within the gap such that it is three times farther from shield 1 than from shield 2. Since the field from current acting on the FREE layer will also change by this offset of the sensor, pinned layer thickness will require proper optimization to obtain near zero signal for read head for magnetic recording application.

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