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Browse Prior Art Database

Chip attachment method with adjustable chip placement angle

IP.com Disclosure Number: IPCOM000014132D
Original Publication Date: 2001-Jan-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 2 page(s) / 63K

Publishing Venue

IBM

Abstract

This describes new method to directly attach chip on rigid substrate such as glasses to be used for liquid crystal display products by using anistropic conductive tape. Invented process flow is described as follows. The advantage of this invented process is that even pressure from heater head is given to the anistropic conductive tape. process flow referring to fig. 1) (1) Glass substrate thickness at both ends where chip is to be placed, are measured by such as laser measuring tool prior to chip placement .

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Chip attachment method with adjustable chip placement angle

     This describes new method to directly attach chip on rigid substrate such as glasses to be used
for liquid crystal display products by using anistropic conductive tape.

         Invented process flow is described as follows. The advantage of this invented process is
that even pressure from heater head is given to the anistropic conductive tape.

( process flow referring to fig. 1)

             (1) Glass substrate thickness at both ends where chip is to be placed, are measured
by such as laser measuring tool prior to chip placement .

            (2) If the substrate thickness of these two measured points are different, ,
declined angle A as shown in fig.1 is calculated by tan-1 = ( thickness delta between two sides ) /
( chip length )

            (3) Calculated declined angle A is fed back to heater head angle B of chip
placement for its adjustment, where angle B equals to angle A.. The purpose of angle B adjustment
prior to chip placement is
to make the distance between chip and substrate surfaces parallel in order to
steadily press anistropic conductive tape.

           (4) Heater head picks up chip and moves down to the surface of substrate where
anistropic conductive tape is already attached.

                Accordingly , heater head can give even pressure to anistropic conductive tape
for assuring reliable joint.

declined angle B

semiconductor chip

laser m easuring tool for height

heater head

laser m...