Browse Prior Art Database

Plating Cluster With Composition Measurement

IP.com Disclosure Number: IPCOM000014206D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Related People

Robert Browne: AUTHOR [+4]

Abstract

This publication describes the inclusion of a composition analysis device in an electroplating cluster tool. Following plating, it is desireable to determine the composition (ratio of metals in the alloy) of the plated films. With a composition metrology unit in the cluster, the robot will transfer the wafer to that module following plating. Composition data will then be collected and used to disposition the wafer and adjust the process (if needed) for optimum results. 1

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Plating Cluster With Composition Measurement

   This publication describes the inclusion of a composition analysis device in
an electroplating cluster tool. Following plating, it is desireable to determine
the composition (ratio of metals in the alloy) of the plated films.

   With a composition metrology unit in the cluster, the robot will transfer the
wafer to that module following plating. Composition data will then be collected
and used to disposition the wafer and adjust the process (if needed) for optimum
results.

1