Browse Prior Art Database

Skew Adjustment Method with Considering Thermal Influence

IP.com Disclosure Number: IPCOM000014241D
Original Publication Date: 2000-Dec-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 33K

Publishing Venue

IBM

Abstract

Disclosed is a method for an adjustment of skew of signals on a circuit board with considering thermal influence. The method provides high reliability for thermal variation in customer environments.

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Skew Adjustment Method with Considering Thermal Influence

   Disclosed is a method for an adjustment of skew of signals on a circuit board
with considering thermal influence. The method provides high
reliability for thermal variation in customer environments.

It becomes important to adjust skew of clock signals, control signals, and
data signals precisely in these days. These critical signals should be
patterned on a print circuit board very carefully with considering skews among
them. However propagation of these signals inside components will be affected
by temperature and temperatures around each components are not same, so it
might not work as expected in some case even though patterning on the board
are done very carefully.

The disclosed method will solve this kind of problem. Driver modules with
skew adjustment function, that is on the market, are placed between components
for critical signals and thermal sensor modules are placed around related
components. Then the skew is adjusted dynamically with monitoring
temperatures. The figure below is an example.

   The firmware is monitoring temperatures around component 1 and 2 by using the
thermal sensors. Then the firmware select the best skew value and
set it into the driver module according to the measured temperatures. These
skew adjustment is done dynamically.

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