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METHOD OF ACHIEVING A TF HEAD WITH NO ALUMINA PROTRUSION

IP.com Disclosure Number: IPCOM000014299D
Original Publication Date: 2000-Jan-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Abstract

Published is a method of building a Thin Film Head with No Alumina Protrusion. Current process capabilities for Pole Tip Recession are currently limited by process steps that influence trailing edge alumina protrusion. This publication provides a method for eliminating this material as a part of the wafer build up, allowing for improved pole tip recession capability.

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METHOD OF ACHIEVING A TF HEAD WITH NO ALUMINA PROTRUSION

   Published is a method of building a Thin Film Head with No Alumina Protrusion.
Current process capabilities for Pole Tip Recession are currently limited by
process steps that influence trailing edge alumina protrusion. This publication
provides a method for eliminating this material as a part of the wafer build up,
allowing for improved pole tip recession capability.

   Current wafer build processes encapsulate the read & write elements of a TF
head in a thick alumina encapsulation layer. This has been a historical part of
the TF head structure for many years, but does not play a direct role in the
magnetic performance of the device. This layer is known to expand and protrude
beyond the plane of the air bearing surface of the head, as the head flies over a
disk surface. It is considered to be a mechanical reliability issue and had
required changes in the head fabrication process to reduce its impact. These
processes have had a negative impact on pole tip recession, a critical parameter
in the magnetic performance of the head. Therefore the elimination of the cause
of head protrusion would allow significant improvements in pole tip recession.

   The solution to the problem posed above is based in the wafer fabrication
process. Rather than depositing a single, thick film of alumina over the pole
tips, this method would deposit a thin layer of non-etchable material over the
pole pieces. Then the remaining encapsulating material would be deposited as it
is done today. A low cost wet etch process could then be used to etch away the
larger encapsulation layer, leaving only a thin layer of etch barrier over the
pole pieces. This could be...