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High Speed Ultrasonic Bonder for delicate substrates

IP.com Disclosure Number: IPCOM000014420D
Original Publication Date: 2000-Aug-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 27K

Publishing Venue

IBM

Abstract

Disclosed is a device used to ultrasonically bond ultrasensitive applications such as ambient temperature gold flat leads on soft substrates. The device is capable of bonding sensitive applications at 2 bonds per second. It is flexible enough to perform on a wide range of applications, including: actuator assembly (hard flat lead soft substrate gold-gold); tape head assembly (soft flat lead soft substrate), and specialty heads assembly (round wire hard, delicate crystal substrate).

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High Speed Ultrasonic Bonder for delicate substrates

   Disclosed is a device used to ultrasonically bond ultrasensitive applications
such as ambient temperature gold flat leads on soft substrates. The device is
capable of bonding sensitive applications at 2 bonds per second. It is flexible
enough to perform on a wide range of applications, including: actuator assembly
(hard flat lead - soft substrate - gold-gold); tape head assembly (soft flat lead
- soft substrate), and specialty heads assembly (round wire - hard, delicate
crystal substrate).

This device consists of a high speed, pivoting, low rotational inertia bond head
with bond tip force balanced by combination of voice coil actuator and dead
weight. The system uses a commercially available generator/transducer pair and a
commercially available, high speed XY stage. It also features a servo controlled,
air cooled commercially available voice coil actuator. All electrical and
mechanical actions are controlled by customized software and a personal
computer. Computer control integrated with the electronics provides real-time
custom bond tip force profiles with an accuracy of + or - 0.5 %, It also retains,
in memory, feedback from the ultrasonic settings, retains calibration data and
communicates with a host for data collection purposes. This device can be
assembled at a cost of 1/3 of commercally available ultrasonic bonders based on
market survey of competitively offered machines.

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