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Equipment Design Change For End Point Detection For Front Side Wafer Applications

IP.com Disclosure Number: IPCOM000014430D
Original Publication Date: 2001-Aug-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Abstract

Disclosed is a tooling method for frontside end-point detection in semiconductor and thin film wet processes, most importantly, etch and damascene plating. The idea incorporates the optical reflectance principle for monitoring an area of interest on the wafer, for a change in reflectance, indicating a change in state of the film on the wafer.

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  Equipment Design Change For End Point Detection For Front Side Wafer Applications

   Disclosed is a tooling method for frontside end-point detection in semiconductor and thin film wet processes, most importantly, etch and damascene plating. The idea incorporates the optical reflectance principle for monitoring an area of interest on the wafer, for a change in reflectance, indicating a change in state of the film on the wafer.

   There are various tool designs from a number of manufacturers for front and backside wafer processes. Many of these are for use in etch and damascene plating operations for semiconductors and thin film heads for disk drives. In addition, there are various other applications in use such as cleaning, etch, nitride/oxide etch, polymer removal, gold etch, etc.

   At present, the only end-point detection system in use looks at the backside of the wafer. It is an optical detector mounted on a swing arm that monitors the wafer as the arm dispenses chemical as it arcs across the wafer. If the various system designs were changed to allow for the necessary hardware to be added to incorporate optical reflectance into the tools for frontside applications, a closed loop system could be put into place allowing for absolute control of the end of the process. The reflectance system would look at the frontside of the wafer, in a particular area of interest. In the case of damascene plating and copper etch of the edge exclusion zone after plating, the detector woul...