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Plating Module In A Cluster Tool

IP.com Disclosure Number: IPCOM000014446D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Robert Browne: AUTHOR [+4]

Abstract

This publication describes a new electroplating equipment configuration using the cluster tool concept. This is a cassette-to-cassette operation in that the manufacturing operator places a cassette of wafers in the load/unload module and removes a cassette of completed (plated) wafers. Within the cluster tool, a robot moves the wafers one at a time from the load position to the plating module where the wafer is pre-treated (optional), plated, rinsed, and dried. Upon completion, the robot returns the wafer to an output cassette in the load/unload module.

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Plating Module In A Cluster Tool

   This publication describes a new electroplating equipment configuration using the cluster tool concept. This is a cassette-to-cassette operation in that the manufacturing operator places a cassette of wafers in the load/unload module and removes a cassette of completed (plated) wafers. Within the cluster tool, a robot moves the wafers one at a time from the load position to the plating module where the wafer is pre-treated (optional), plated, rinsed, and dried. Upon completion, the robot returns the wafer to an output cassette in the load/unload module.

   This configuration is intended for plating nickel-iron alloys, but may be used to plate other metals such as gold, copper, tin-lean, etc.

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