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A NEW MICRO-DEVICE PRODUCTION METHOD BY USING RESIST REMOVAL REDUCTION PROCESS (RRR process)

IP.com Disclosure Number: IPCOM000014489D
Original Publication Date: 2001-Oct-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 3 page(s) / 164K

Publishing Venue

IBM

Abstract

A new micro-device production method by using Resist Removal Reduction process (RRR process)

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  A NEW MICRO-DEVICE PRODUCTION METHOD BY USING RESIST REMOVAL REDUCTION PROCESS (RRR process)

A new micro-device production method by using Resist Removal Reduction process (RRR process)

T. Sakai
1. Abstract This article describes a new method for producing the micro-device. This is a new process which can reduce photo resist removal step. (Resist Removal Reduction process , RRR process) This RRR process uses the leveling method which level the surface made by photo resist pattern by the resist solvent.

2. Comparison the conventional method and this new method

Micro-device productions such as DRAM and TFT (Thin film transistor) consist of more than two layers

which have different pattern respectively (see fig1.) . To make bottom layer, micro-device production process conventional ly need the photo resist removing step. (see fig2. left side ) .

But with this new method , the photo resist removing step can be skipped (see fig2. right side ).

So this new method can make micro-device production process simply and cheaply.

3. This new method
3.1.Process flow

To skip the photo resist removing step, this new method uses "the leveling method of resist layer by the resist solvent" (see fig3.).
·With this leveling method, the photo resist can be applied without removing the first resist layer. ·
· This leveling method comes from two step ( which are processed continuously with the resist coating tool).

One is the resist solvent coating step to level patterned resist layer....