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Design data editting method for fine pitch pattern

IP.com Disclosure Number: IPCOM000014522D
Original Publication Date: 2001-Jul-11
Included in the Prior Art Database: 2003-Jun-19
Document File: 1 page(s) / 78K

Publishing Venue

IBM

Abstract

Disclosed is a design data editting method for printed circuit board (PCB) with fine pitch pattern to achive bare chip assembly and/or TAB assembly.

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Design data editting method for fine pitch pattern

    Disclosed is a design data editting method for printed circuit board (PCB) with fine pitch pattern to achive bare chip assembly and/or TAB assembly.

The amount of etching of conductive pads varies as a function of the density of the pads or the space between pads. Thus to keep good unifomity of the pads and line width, manufacturing adjustment factor should be added according to pattern pitch and space on design data.

AA B A< B

M a n u fa c tu r in g a ju s tm e n t fa c to r

E quality editting

P ad data


Inequality
editting

Fig1. shows the example of the design data editting method for fine pitch pad such as flip chip attachment on PCB.

Unit 1(Equality editing: 35um)

Unit 2(Equality editing: 25um)

Unit 3(Inequality editing)

(Inequality editing : 25um)

(equality editing : 15um)

(Inequality editing : 25um)

Fig2. shows the exsample of the design data editting method for entry line of fine pitch pads.

1

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