Browse Prior Art Database

EMI finger for socket type CPU heat sink

IP.com Disclosure Number: IPCOM000014526D
Original Publication Date: 2001-Jun-01
Included in the Prior Art Database: 2003-Jun-19
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Abstract

EMI FINGER FOR SOCKET TYPE CPU HEAT SINK This article describes new EMI finger for socket type CPU heat sink. This finger can make a CPU heat sink ground to motherboard easily and reliably. Standard heat sink and clip can use for stable ground. Heat sink sometime became the antenna of CPU radiation noise. EMI radiation noise from heat sink will be prevented by grounding the heat sink. The finger is made of steel sheet with spring back strength. CPU Heatsink Heatsink Clip

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EMI finger for socket type CPU heat sink

EMI FINGER FOR SOCKET TYPE CPU HEAT SINK

  This article describes new EMI finger for socket type CPU
heat sink. This finger can make a CPU heat sink ground to
motherboard easily and reliably. Standard heat sink and
clip can use for stable ground. Heat sink sometime became
the antenna of CPU radiation noise. EMI radiation noise
from heat sink will be prevented by grounding the heat
sink. The finger is made of steel sheet with spring back
strength.

CPU Heatsink

Heatsink Clip

CPU

New EMI Finger

Motherboard

Socket

Fig-2

Fig-1 CPU Heat sink and mother board

Fig-2 shows the ground pad on the planar board. The CPU
finger is soldered on the grand pad. CPU Clip can contact
with the finger. CPU clip is made of steel and Heat sink
is of from Aluminum. So finally the CPU heat sink can
contact to planar ground steadily

1

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New Finger

Fig-2 New Finger and Ground Pad

G round Pad

Socket

2

[This page contains 3 pictures or other non-text objects]