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Improved Laser Micro-machining and Ablation of Materials/Films with Variable Multi-beams/Wavelength equipment and processing

IP.com Disclosure Number: IPCOM000014610D
Original Publication Date: 2000-Aug-01
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Abstract

For advanced photolithography exposure, laser micromachining and ablation of

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  Improved Laser Micro-machining and Ablation of Materials/Films with Variable Multi-beams/Wavelength equipment and processing

   For advanced photolithography exposure, laser micromachining and ablation of
single of multi-phase materials, a single light source (optical, laser... etc) of
one wavelength is normally used for these applications. Described is the use of
multi-source and wavelength light source (laser /optical) to process
multi-component ceramic or stack of multi-layer thin films. The use of these
various wavelength sources focusing on one processing surface will facilitate
opening up much larger process windows and improve the properties of the
processing surface.

Here are two examples that show the advantages of this method:
1) One practical application is the use of multi-wavelength source in
laser micromachining of multi-phase ceramic substrate such as AlTiC
(Al2O3/TiC/ZrO...) that is being used in recording heads. For multi-phase ceramic
material such as AlTiC, the Al2O3 phase may have optimal optical absorption
coefficient in one wavelength range while the TiC phase may have peak absorption
in another range. As the result, one laser wavelength may be sufficient to
optimize ablation Al2O3 phases but cause excess heating and melting of TiC
phases. As the result, the use of one wavelength laser may not ablate the surface
of ceramic materials cleanly and create excessive surface roughness, unwanted
heating and melting, etc. The use of multi-lasers with various wavelength...