Browse Prior Art Database

Grounding Device for Socket-type Processor Heatsink

IP.com Disclosure Number: IPCOM000014630D
Original Publication Date: 2000-Dec-23
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 38K

Publishing Venue

IBM

Abstract

This metal part is designed to ground a socket-style heatsink to grounded solder pads on the planar. Planars are configured with 3 through-holes on each side of a processor PGA socket. This part pokes into the holes and can be mechanical retained or may be wave soldered onto the planar. Then the heatsink is clipped onto the cpu socket, which slightly deforms the grounding device and forms a solid EMI ground path. Heatsinks can radiate EMC emissions from processors and this device will ground the heatsink and lower EMC levels.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Grounding Device for Socket-type Processor Heatsink

    This metal part is designed to ground a socket-style heatsink to grounded solder pads on the planar. Planars are configured with 3 through-holes on each side of a processor PGA socket. This part pokes into the holes and can be mechanical retained or may be wave soldered onto the planar. Then the heatsink is clipped onto the cpu socket, which slightly deforms the grounding device and forms a solid EMI ground path. Heatsinks can radiate EMC emissions from processors and this device will ground the heatsink and lower EMC levels.

10K1533.pdf

1

[This page contains 2 pictures or other non-text objects]