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Browse Prior Art Database

Probe Card with Flexible Wiring Mechanism

IP.com Disclosure Number: IPCOM000014669D
Original Publication Date: 2000-Aug-01
Included in the Prior Art Database: 2003-Jun-20
Document File: 3 page(s) / 59K

Publishing Venue

IBM

Abstract

Disclosed is a wafer test probe card with flexible wiring structure. Conventional probe card is constructed by printed circuit board and probe needles, and there are two ways to deliver VDD and/or GND to the needles. One is treating VDD and/or GND as signals. This allows us to use same probe card for any parts numbers whose physical pad layout is equal. However, this causes higher VDD/GND impedance and less VDD/GND stability. Another is having VDD and GND planes in the printed circuit board. This gives us the best VDD/GND stability but need to built probe card for the every specific part numbers. The disclosed probe card with flexible wiring structure consists of stacked two printed circuit boards and probe needles as shown in Fig.1. Two printed circuit boards shall be fastened by screws etc. as shown in Fig. 2.

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Probe Card with Flexible Wiring Mechanism

Disclosed is a wafer test probe card with flexible wiring structure.

Conventional probe card is constructed by printed circuit board and probe
needles, and there are two ways to deliver VDD and/or GND to the needles.
One is treating VDD and/or GND as signals. This allows us to use same probe
card for any parts numbers whose physical pad layout is equal. However, this
causes higher VDD/GND impedance and less VDD/GND stability.

Another is having VDD and GND planes in the printed circuit board. This gives
us the best VDD/GND stability but need to built probe card for the every
specific part numbers.

The disclosed probe card with flexible wiring structure consists of stacked
two printed circuit boards and probe needles as shown in Fig.1. Two printed
circuit boards shall be fastened by screws etc. as shown in Fig. 2.

Upper printed circuit board is signal assignment part . This part has VDD
plane and GND plane and VDD/GND can be delivered through VDD/GND planes in
this printed circuit board . Signals lines will be wired so that connecting
tester signal channel to appropriate chip pad on wafer .

This structure presents a less power noise and better stability of VDD and/or
GND, because this part is customized for the specific VDD/GND pad layout.
Lower printed circuit board is needle assembly part and simply conduct any
electrical signals including VDD/GND to the needle. This part is common for
all parts numbers whose physical pad layout is equa...