Browse Prior Art Database

LCD MODULE STRUCTURE

IP.com Disclosure Number: IPCOM000014679D
Original Publication Date: 2000-Sep-01
Included in the Prior Art Database: 2003-Jun-20
Document File: 4 page(s) / 47K

Publishing Venue

IBM

Abstract

Disclosed is a Chip On Glass (COG) LCD module structure which minimizes the LCD module peripheral packaging area and thickness with lower cost by re-layout of the driver IC pad and related FPC.

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LCD MODULE STRUCTURE

Disclosed is a Chip On Glass (COG) LCD module structure which minimizes the
LCD module peripheral packaging area and thickness with lower cost by
re-layout of the driver IC pad and related FPC.

1. Conventional COG module design
Figure-1 shows the conventional COG module structure. The driver IC is mounted
on the glass and FPC is attached outside of the driver IC, which requires
packaging area "B" for total. In this structure, the driver IC is designed as
figure-2 (Input bumps are arranged on outside.) and the input signal
electrodes are placed as figure-3 and connected to outside FPC.

1

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2. Disclosed COG module design
Figure-4 and figure-5 show the disclosed COG module structure and driver IC
design respectively. The differences from the conventional structure are both
layout of the FPC and the driver IC pad layout fitting with FPC layout. FPC
is placed between the driver ICs, which results in smaller packaging area than
conventional structure. The input bumps of the driver IC are arranged on both
side of the IC (figure-4) and the input signal patterns are horizontally
placed. The packaging dimension (same dimension as "B" in figure-1) can be
reduced to minimal.

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Figure-6 shows more advanced disclosed structure. The electrical connections
between driver IC are just done by electrodes on the glass without FPC. The
input si...