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Cleaning Delicate MEMS Structures

IP.com Disclosure Number: IPCOM000014712D
Original Publication Date: 2001-Mar-01
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Abstract

Fabrication of devices including MEMS delicate MEMS structures such as MEMS cantilever arrays can introduce small particles to the surface of the structures. These particles can interfere with alignment of the structures in the nanometer range. PDMS-Polydimethylsiloxan can be employed to remove the unwanted particles. The PDMS is first hardened on a flat surface. Next, the PDMS is released from the surface and brought into contact with the structure. The particles adhere to the surface of the PDMS. The PDMS is then removed from the structure. The particles remain attached to the PDMS thereby removing them from the structure without destroying delicate formations in the structure. 1

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Cleaning Delicate MEMS Structures

  Fabrication of devices including MEMS delicate MEMS structures
such as MEMS cantilever arrays can introduce small particles to the
surface of the structures. These particles can interfere with
alignment of the structures in the nanometer range.

PDMS-Polydimethylsiloxan can be employed to remove the unwanted
particles. The PDMS is first hardened on a flat surface. Next,
the PDMS is released from the surface and brought into contact
with the structure. The particles adhere to the surface of the
PDMS. The PDMS is then removed from the structure. The particles
remain attached to the PDMS thereby removing them from the
structure without destroying delicate formations in the
structure.

1