Browse Prior Art Database

Thermoconductive device in HDD for reliability enhancement

IP.com Disclosure Number: IPCOM000014746D
Original Publication Date: 2001-Mar-01
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 26K

Publishing Venue

IBM

Abstract

Disclosed is a method to conduct the heat from a IC uniformly by inserting a thermal conductor material between a Disk Enclosure (DE) and the top of the IC package on a logic card of a Hard Disk Drive (HDD). Recently a data processor IC's power consumption increases as the data rate of the HDD goes up. As the result, the heat from the IC goes up, too. And slowing thermal variation and reducing the IC junction temperature is required to keep the reliability of the IC. Inserting the thermal conductor between the DE and the top of the IC package is able to make another thermal conduction path toward the DE in addition to toward the air and the board.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Thermoconductive device in HDD for reliability enhancement

Disclosed is a method to conduct the heat from a IC uniformly by
inserting a thermal conductor material between a Disk Enclosure
(DE) and the top of the IC package on a logic card of a Hard Disk
Drive (HDD).

Recently a data processor IC's power consumption increases as the
data rate of the HDD goes up. As the result, the heat from the
IC goes up, too.

And slowing thermal variation and reducing the IC junction
temperature is required to keep the reliability of the IC.

Inserting the thermal conductor between the DE and the top of the
IC package is able to make another thermal conduction path toward
the DE in addition to toward the air and the board.

The DE has enough thermal capacity to slow the thermal variation.
And the air convection cools the DE surface and lowers the
temperature.

< Thermal Path >

______________________________________________________________

| | ----> to
| | air
| Disk Enclosure |
|______________________________________________________________|

     | |A
| Thermal Conductor||toDE through
| | | Themal Conductor
______|___________________|_|____

            | | ----> to air through
| IC | a package
| | ----+ to board through
| | a frame
==============|========= LOGIC BOARD ===========|=====V==============

+----> to air

1