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Fine pitch structure with taper through hole drilled by laser drill

IP.com Disclosure Number: IPCOM000015180D
Original Publication Date: 2002-Apr-11
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 36K

Publishing Venue

IBM

Abstract

This invention is applied to fine pitch taper through hole structure in base core of builed-up printed wiring board. The hole shape drilled by laser drill is generally taper. The following structure is finer than the general structure. 1

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Fine pitch structure with taper through hole drilled by laser drill

   This invention is applied to fine pitch taper through hole structure in base core of builed-up printed wiring board.

The hole shape drilled by laser drill is generally taper. The following structure is finer than the general structure.

1

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