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Row Level Kisslap Machine With Direct Feedback

IP.com Disclosure Number: IPCOM000015274D
Original Publication Date: 2002-Sep-08
Included in the Prior Art Database: 2003-Jun-20
Document File: 2 page(s) / 171K

Publishing Venue

IBM

Abstract

Disclosed i s a Kiss-Lap machine with a direct feedback method for predicting material removal during lapping.

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Row Level Kisslap Machine With Direct Feedback

Disclosed i s a Kiss-Lap machine with a direct feedback method for predicting material removal during lapping.

In this implementation, a common membrane or diaphragm with a sticky film, is stretched across the three chamber fixture to form a pressure tight ballast air cushion instead of a sponge. Air supply to each chamber is provided to apply uniform and adjustable lapping force to each chamber where rows will be later mounted. The lapping platform has wear pads, which are used to maintain the correct distance between the membrane and lapping plate.

Figure 1.

Figure 2

Air Supplies in chambers 1, 2 and 3

Membrane

Added to the center chamber is a sense row (product row or row with ELG) having electrical sensors that will monitor material removal.

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To increase ELG life, a cascading ELG is disclosed, having a plurality of devices, each stepped higher than the other so that lapping can commence on the first stripe and when maximum resistance is reached, the onboard computer will switch to the next in succession.

Termination to sense rows presents a challenge that has limited prior implementation of feedback. For Pico, termination such as wiring must fit within the 0.3 mm row height and not be pushed into the plate by the lapping pad deformation around the row. For this two methods are best suited for such termination. One is a wiring harness the other...