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Custom profile, plastic heat exchanger system

IP.com Disclosure Number: IPCOM000015303D
Original Publication Date: 2001-Nov-18
Included in the Prior Art Database: 2003-Jun-20
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Abstract

Disclosed is a device that takes advantage of the natural cavity formed by gas-assisted, plastic injection molding. The cavity can be filled with a liquid or gas to transport heat from point to point. Common molding techniques can be used to form customized shapes and sizes to fit a wide variety of applications.

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Custom profile, plastic heat exchanger system

Disclosed is a device that takes advantage of the natural cavity formed by

gas-assisted, plastic injection molding. The cavity can be filled with a liquid

or gas to transport heat from point to point. Common molding techniques can

be used to form customized shapes and sizes to fit a wide variety of applications.

There are several important elements to this device. The natural cavity formed by the process of gas-assisted, injection molding is critical. This cavity can be fill with a liquid or gas to act as the heat transfer medium. The liquid or gas can be hermetically sealed, thus forming a closed, leak resistant system without joints and connections. Because the device is formed from plastic materials and processes it can be formed with existing materials, tooling and design practices. Plastic mounting techniques can be employed like snap fits, alignment posts and screw bosses. The device size and shape can be scalable to fit the desired application. Customized fits can be developed to accommodate microprocessors, electronic components, motors, fans, mounting brackets and electronic boards. Unique features can be employed like cooling fins, directed channels and tubing.

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