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The top structure and process of Vacuum Pad for Solder Ball Locate & Laser Reflow (SBL2R) machine

IP.com Disclosure Number: IPCOM000015663D
Original Publication Date: 2002-Mar-14
Included in the Prior Art Database: 2003-Jun-20
Document File: 3 page(s) / 174K

Publishing Venue

IBM

Abstract

The top structure and process of Vacuum Pad for Solder Ball Locate Laser Reflow (SBL2R) machine Solder Ball Locate Laser Reflow (SBL2R) Machine is an equipment to connect a Head to an Integrated Lead Suspension (ILS) by soldering in Head Gimbal Assembly (HGA) process (Fig.1). To pick up, carry and locate solder balls accurately onto joints which is composed of pad of ILS and Head as a 90-degree angle, a tool called Vacuum Pad is used, which has the key structure shown as follows (Fig.2).

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  The top structure and process of Vacuum Pad for Solder Ball Locate & Laser Reflow (SBL2R) machine

Solder Ball Locate & Laser Reflow (SBL2R) Machine is an equipment to connect a Head to an Integrated Lead Suspension (ILS) by soldering in Head Gimbal Assembly (HGA) process (Fig.1). To pick up, carry and locate solder balls accurately onto joints which is composed of pad of ILS and Head as a 90-degree angle, a tool called Vacuum Pad is used, which has the key structure shown as follows (Fig.2).

Slider

ILS pad

Solder ball moves

1. It consists of 4 slits with a hole inside respectively. The holes are designed to pick up/locate 4 solder balls at the same time by suction/N2 gas flowing. To form these holes, an Eximer Laser Method is thought to be the most suitable. (Fig.3(a))

Fig.1 Solder ball locating by using a

Fig.2 Vacuum pad A past design Vacuum pad

1

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 Gas flowing

Vacuum

2. The slits are for the purpose of holding solder balls stably during the conveyance and locating accurately. To locate solder balls accurately onto the joint which is composed of pad of ILS and Head as a 90-degree angle, the tip of slits are processed into 90-degree cut side. (Fig. 3(b))

Dicing is one of the methods to process slits.

3. To prevent the edge of a hole from cutting into a ball, the edge is chamfered (shown as Fig.4).

Suction hole

Chamfer

Solder ball

(a) (b)

90

°

Slit

Slider ILS pad

Fig.3 The structure of Vacuum pad...