Browse Prior Art Database

Structure and method for Via capped RFP

IP.com Disclosure Number: IPCOM000015760D
Original Publication Date: 2002-Jun-01
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Abstract

Two strucure and method for via capped RFP are shown as the following; 1. Via capped RFP structure made by using trepaning mode of laser drill machine Trepaning mode can make fig.1 like vias; Process : fig. 1 (a) fig. 1 (b) fig.1 (c) fig.2

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Structure and method for Via capped RFP

Two strucure and method for via capped RFP are shown as the following;

1. Via capped RFP structure made by using trepaning mode of laser drill machine

Trepaning mode can make fig.1 like vias;

Process : fig. 1 (a) -> fig. 1 (b) -> fig.1 (c) -> fig.2

           fig.1 (a) Trepaning mode laser beam fig.1 (b) Resuded resin around the center of via fig.2 (c) Cross section of vias made by using trepaning mode.

                 trajectory is shown. Blue can be removed by punching mode of laser This method can control not to drill and remove

circle is laser beam spot. drill machine, which is single shot.

resin filled in PTH.

This spot moves along the

circle.

fig.2 Via capped RFP structure made by using Trepaning mode of laser drill machine.

2. Via capped RFP strucre made by using normal drilling process

Normal drilling mode can make fig.3 like vias;

Process : fig. 3(a) -> fig.3 (b) -> fig.4

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fig.3 (a) Top view of vias which fig.3 (b) Cross section of vias made by using

Normal laser drilling process normal laser drilling process. This

makes. method is difficult to stop removing

some resin filled in PTH. But this method is able to make via capped RFP structure in the aspect ratio whice adequetly is covered plating thickness around via bottom.

fig.4 Via capped RFP structure made by using normal laser drilling process.

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