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Avoding moisture condensation on refrigeration cooled MCMs (T-Rex type design) exposed to ambient air

IP.com Disclosure Number: IPCOM000015818D
Original Publication Date: 2002-May-21
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Abstract

The problem with refrigeration cooled MCMs is that if the MCM outer wall temperature goes below the dew point, condensation will occur and corrode the MCM pins that connect the MCM ceramic substrate to the mother board. A good MCM design would avoid temperatures below the dew point, but under extreme conditions, the MCM could happen to be cooler than the dew point. The proposed invention ensures that moisture condensation is avoided even under extreme ambient conditions when the MCM temperature happens to go below the dew point of the ambient. Air deflector Air-flow duct Finned heat sink

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  Avoding moisture condensation on refrigeration cooled MCMs (T-Rex type design) exposed to ambient air

         The problem with refrigeration cooled MCMs is that if the MCM outer wall temperature goes below the dew point, condensation will occur and corrode the MCM pins that connect the MCM ceramic substrate to the mother board. A good MCM design would avoid temperatures below the dew point, but under extreme conditions, the MCM could happen to be cooler than the dew point. The proposed invention ensures that moisture condensation is avoided even under extreme ambient conditions when the MCM temperature happens to go below the dew point of the ambient.

Air deflector

Air-flow duct

Finned heat sink

Driip pan

Refrigeration tubesAir flow inin air-flow duct

Air flow out

      The refrigerated MCM design shown in the figure is a modification of a typical refrigeration-cooled MCM design. The modification is the proposed invention. It involves diverting some of the air flowing through the finned heat sink to flow around the MCM. When the MCM processor chips are being cooled by the refrigeration system, a slow stream of air is flowed through the finned heat sink, also cooled by the evaporator. Since the heat load is in the MCM hat and there is no heat load in the finned heat sink, the finned heat sink will be at much lower temperature than the MCM hat. Condensation

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will occur on the finned heat sink. The drier air coming out of the finned heat sink will be diverted to flow do...