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Multilayer Printed Circuit Board power distribution.

IP.com Disclosure Number: IPCOM000015870D
Original Publication Date: 2002-Dec-23
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 72K

Publishing Venue

IBM

Abstract

In multilayer electronic cards, some internal layers are generally reserved for the power supplies, also known as power plans. These power plans are not accessible to perform any current measurements or to feed the card with an external power supply.

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Multilayer Printed Circuit Board power distribution.

In multilayer electronic cards, some internal layers are generally reserved for the power supplies, also known as power plans. These power plans are not accessible to perform any current measurements or to feed the card with an external power supply.

(1)

(2)

(6) (3)

(4) (5)

Card

A B

= current flow

Figure 1

    Figure 1 shows a cross section view of the card illustrating the purposed power supply design. In this architecture, the output of the power supply (1) is not connected directly to the internal power plan (2) but to a wide copper land (3) on the bottom layer of the card using vias (4). Wide copper land (3) is connected to internal power plan (2) through vias (5). Wide copper land (3), that comprises two copper shapes ( A and B ) with no solder mask, may be cut to open the circuit as illustrated with arrow (6) and dotted lines on pictures 1 and 2.

(5)

(3)

(4)

(6)

Picture 1 Picture 2

1

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    Picture 1 is a view of the card when the circuit is not open for a standard use while picture 2 is a view of the card when the circuit is open to measure current between copper shapes A and B . Likewise, when the circuit is open, an external power supply may be connected to copper shape B. It is to be noticed that copper shapes A and B may be connected with a conductive wire after the card has been tested so as to be used normally.

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