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Aluminum-Inserted Mold AE Bracket to Decrease AE Junction Temperature

IP.com Disclosure Number: IPCOM000015881D
Original Publication Date: 2002-Jul-10
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Abstract

Disclosed is the AE bracket thermal resistance reduction method in HDD AE chip module thermal integration design. Figure-1 shows the structure of actuator arm with AE flex cable assembly. Figure-2 shows a cross section around AE chip, which is attached to the flex cable by DCA (direct chip attachment), or by soldering with AE module's pins. On the opposite side of flex cable around AE chip, aluminum or stainless (SUS) small plate which has 0.2-0.5mm thickness, called as "stiffener", is attached by adhesive in flex cable assembly beforehand, to strengthen flex to fix it to actuator comb, and to absorb AE generated heat. There is two ways to fix flex assembly to actuator comb, which is made by aluminium block, stacked stainless or both combination. (1) Direct with screw or by soldering brass pin which arises from comb, or (2) with bracket, here called as "AE bracket" between flex assembly and comb. AE bracket has 0.5-1mm thickness, and is made by insulator material (example: plastic) which thermal resistance is usually high. The generated heat becomes maximum during continuous write operation, and its heat moves from AE junction to flex, stiffener, AE bracket and actuator comb which absorbs heat finally and releases it to the air flow inside DE (disk enclosure). In case of high data product which requires (2)'s AE bracket by mechanical and/or HSA manufacturing process reasons, AE junction temperature (Tj) may become beyond allowed maximum, if AE bracket thermal resistance isn't enough low. Then, figure-3 introduces disclosed "Alumi-inserted mold" AE bracket which thermal resistance is very low (example: 1-2 deg.C/W). Inserted aluminium portion conveys heat effectively from stiffener to comb.

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Aluminum-Inserted Mold AE Bracket to Decrease AE Junction Temperature

    Disclosed is the AE bracket thermal resistance reduction method in HDD AE chip module thermal integration design. Figure-1 shows the structure of actuator arm with AE flex cable assembly. Figure-2 shows a cross section around AE chip, which is attached to the flex cable by DCA (direct chip attachment), or by soldering with AE module's pins. On the opposite side of flex cable around AE chip, aluminum or stainless (SUS) small plate which has 0.2-0.5mm thickness, called as "stiffener", is attached by adhesive in flex cable assembly beforehand, to strengthen flex to fix it to actuator comb, and to absorb AE generated heat. There is two ways to fix flex assembly to actuator comb, which is made by aluminium block, stacked stainless or both combination. (1) Direct with screw or by soldering brass pin which arises from comb, or (2) with bracket, here called as "AE bracket" between flex assembly and comb. AE bracket has 0.5-1mm thickness, and is made by insulator material (example: plastic) which thermal resistance is usually high. The generated heat becomes maximum during continuous write operation, and its heat moves from AE junction to flex, stiffener, AE bracket and actuator comb which absorbs heat finally and releases it to the air flow inside DE (disk enclosure). In case of high data product which requires (2)'s AE bracket by mechanical and/or HSA manufacturing process reasons, AE junction tempera...