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Adventest 1024 Purge Ring

IP.com Disclosure Number: IPCOM000015937D
Original Publication Date: 2002-Oct-18
Included in the Prior Art Database: 2003-Jun-21
Document File: 5 page(s) / 897K

Publishing Venue

IBM

Abstract

1024 Purge Ring operation ; Disclosed is a Purge Ring device (pictured below in Fig.1) that was designed to allow low temperature module testing on an Advantest 1024 test head. This is done by providing a dry nitrogen (N2) blanket around any electronic components. Many electrical components used can be affected by current leakage problems associated with condensation forming on the components when their surfaces temperatures are below the dew point in the surrounding environment. The nitrogen blanket is created by flowing pressurized nitrogen in a manner to create an area that has a slightly higher pressure than the surrounding area. This in turn displaces any air which contains moist with nitrogen which has virtually no moisture content. Design evolution and features;

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Adventest 1024 Purge Ring

1024 Purge Ring operation ; Disclosed is a Purge Ring device (pictured below in Fig.1) that was designed to allow low temperature module testing on an Advantest 1024 test head. This is done by providing a dry nitrogen (N2) blanket around any electronic components. Many electrical components used can be affected by current leakage problems associated with condensation forming on the components when their surfaces temperatures are below the dew point in the surrounding environment. The nitrogen blanket is created by flowing pressurized nitrogen in a manner to create an area that has a slightly higher pressure than the surrounding area. This in turn displaces any air which contains moist with nitrogen which has virtually no moisture content. Design evolution and features;

Purge Pressurization It was found during the design phase that the area to be purged was at a negative pressure when compared to its surrounding environment. This was caused by the test head exhaust fans pulling air out of the electrical connector area across the circuit cards. When N2 was injected at 2 points through .250 inch openings some areas had an even lower pressure which was attributed to venturi affects caused by high velocity N2 flowing through the purge area and across the circuit cards. This was not acceptable as air could be drawn into the low pressure areas causing condensation problems. The solution for this was to inject the N2 in more areas at a lower vel...