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Solvent Fluid Debonder and Cleaner

IP.com Disclosure Number: IPCOM000016008D
Original Publication Date: 2002-Oct-21
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Abstract

The invention described in this disclosure is of particular utility in the processing of single sliders. The Single Slider Process has great advantages for strip height control, flatness and recession/protrusion during lapping. However, in order to be able to implement this scheme, a process must be developed for imparting an air-bearing pattern to individual sliders and successfully debonding and cleaning the sliders. To remove individual sliders from a carrier, the process of debonding and cleaning that is required with existing commercial equipment is extremely limited due to the increased requirements of adhesive/epoxy/planarization materials encapsulating individual single MR devices. Thus the development of schemes for debonding and cleaning of individual sliders is of utmost importance. The unique configuration is that the MR heads are bound into an array with various adhesives and planarized materials as one contiguous surface to allow for liquid resist usage. Due to the aggressive harmony processing defined above, altering the base materials, no known adhesive (off the shelf or custom formulated) can survive the process and be completely removed with a simple chemistry. This disclosure describes a method by which single MR heads or other individual electronic chips can be solvent/aqueous debonded and subsequently lightly cleaned, thereby providing heads or chips with exceptionally low amounts of contamination. This invention requires several elements: The ability to move solvents within a closed system Design of a high flow matrix product tray that permits solvent flow, adhesive particle and mass removal, and product exposure to moving fluid Fluid turbulence generated within the area of the product to be cleaned Fixture the product and tray perpendicular to the flow of the solvent Ability to filter, distill and recover multiple solvents Protect the product from ESD and corrosion mechanisms Ability of tool to meet all safety requirements This disclosure proposes the use of multiple chemical solvents and/or aqueous fluids to remove adhesives, planarization materials, bonding agents and any other contamination resulting from the harmony or previous fabrication processes:

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Solvent Fluid Debonder and Cleaner

The invention described in this disclosure is of particular utility in the processing of single sliders. The Single Slider Process has great advantages for strip height control, flatness and recession/protrusion during lapping. However, in order to be able to implement this scheme, a process must be developed for imparting an air-bearing pattern to individual sliders and successfully debonding and cleaning the sliders. To remove individual sliders from a carrier, the process of debonding and cleaning that is required with existing commercial equipment is extremely limited due to the increased requirements of adhesive/epoxy/planarization materials encapsulating individual single MR devices. Thus the development of schemes for debonding and cleaning of individual sliders is of utmost importance. The unique configuration is that the MR heads are bound into an array with various adhesives and planarized materials as one contiguous surface to allow for liquid resist usage. Due to the aggressive harmony processing defined above, altering the base materials, no known adhesive (off the shelf or custom formulated) can survive the process and be completely removed with a simple chemistry.

This disclosure describes a method by which single MR heads or other individual electronic chips can be solvent/aqueous debonded and subsequently lightly cleaned, thereby providing heads or chips with exceptionally low amounts of contamination. This invention requires several elements:

The ability to move solvents within a closed system Design of a high flow matrix product tray that permits solvent flow, adhesive particle and mass removal, and product exposure to moving fluid Fluid turbulence generated within the area of the product to be cleaned Fixture the product and tray perpendicular to the flow of the solvent Ability to filter, distill and recover multiple solvents Protect the product from ESD and corrosion mechanisms Ability of tool to meet all safety requirements

This disclosure proposes the use of multiple chemical solvents and/or aqueous fluids to remove adhesives, planarization materials, bonding agents and any other contamination resulting from the harmony or previous fabrication processes:

Ability to provide high pressure solvent or aqueous fluids to move across the MR head while being fixtured in a matrix tray design or held as a single unit of product Ability to provide high volume solvent or aqueous fluids to move across the MR head Ability to inject addi...