Browse Prior Art Database

Flip Chip Plastic-Ceramic Module

IP.com Disclosure Number: IPCOM000016286D
Original Publication Date: 2002-Dec-31
Included in the Prior Art Database: 2003-Jun-21
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Abstract

Flip Chip Plastic - Ceramic Module and Plastic - Ceramic MCM incorporates a ceramic connection to the semiconductor chip with a reduced size ceramic body. The ceramic body is then attached to a plastic substrate with BGA balls on the underside of the plastic substrate. One incorporation has multiple ceramic bodies on a single plastic substrate.

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Flip Chip Plastic-Ceramic Module

A module is created by combining ceramic and plastic elements to extend field application usage and minimize cost. Plastic substrate materials have a thermal expansion coefficient that is similar to the printed wiring board (PWB) that modules are mounted on but ceramic modules have an expansion coefficient that is very different from the PWB. On the reverse side, ceramic has an expansion coefficient similar to the chip and plastic has an expansion coefficient very different than the chip. This invention will have a sandwich of ceramic and plastic with the chip attached to the ceramic material and the plastic surface having attachment materials,like ball grid arrays (BGAs), which will attach to the PWB. Furthermore, the high density ceramic will be smaller than the overall module and will have an exit grid that will be attached to the plastic part to optimize the overall cost of the module. This invention resolves the chip size limitations that are experienced by an all plastic module and the module size limitations that are experienced by a ceramic module. With this invention, chip densities that are not wireable in a plastic module can be offered because the ceramic section will have an exit grid that is compatible with the density capability of plastic modules. Furthermore, the ceramic section will create an I/O pattern that is easily escaped by the plastic. The last problem solved is the resistivity of the entire package. Ceramic only packages have high resitivity when used in large modules or need excessive numbers of layers to allow use of large lines. Plastic modules have limited I/O capability unless finer lines are used which then creates excessive resistivity. This combination resolves the problem because the ceramic section has much shorter length and the plastic section which has the long lengths can have wider lines. In summary, the following pro...