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Thermal solution by FAN/Heat sink module with thermal conductive Sub heatsink for FAN Setting

IP.com Disclosure Number: IPCOM000016291D
Original Publication Date: 2002-Nov-16
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 122K

Publishing Venue

IBM

Abstract

·Disclosed is a device for fastening a fan and/or fan-heat sink module mounted on a printed circuit board (PCB) assembly and provides cooling function as a heat sink. The device helps CPU heat to spread below the PCB asemmbly area and works as sub heat sink with the fan inhalation air. This device is also providing a solution to avoid heat spot problems of base cover, because the device doesn't contact with the base cover and no heat conduction between the CPU/fan and base cover is generated. Therefore this device dramatically improves thermal resistance of the fan-heat sink module without heatspot problems. The structure of the device is shown in Fig.1. By connecting with the device by using screws, Fan-heat sink module is fastened on a card assembly. Heat generated by electric components is conducted to the device through the screws of the fan-heat sink module, and the heat is exhausted by the inhalation air. At this time, the device provides concentration of airflow in the direction of the fan intake, heat on the device gets cool effectively by the airflow, that is, total thermal resistance of the fan-heat sink module is decreased. At the same time, the device has the function to avoid heat spot problems of base cover. Since the fan-heat sink module is generally fastened on fan bosses of the base cover or enclosure, fan heat is conducted to the base cover through the fan bosses. Due to the heat conduction on the boss, heat spots appear on the base cover. The heat spot makes customers uncomfortable and occasionally causes a burn at low temperature. As the device has no contact point with the base cover, no such a problem will be brought up. When it is needed to spread heat to base cover for decreasing thermal resistance of fan, a solution is provided by using thermal rubber which makes the device contact with the base cover. As the conclusion, the device improves thermal resistance of the fan-heat sink module and provides a solution to avoid heat spot problems of base cover. Fan/Heat sink module Air flow

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  Thermal solution by FAN/Heat sink module with thermal conductive Sub heatsink for FAN Setting

   ¬∑Disclosed is a device for fastening a fan and/or fan-heat sink module mounted on a printed circuit board (PCB) assembly and provides cooling function as a heat sink. The device helps CPU heat to spread below the PCB asemmbly area and works as sub heat sink with the fan inhalation air. This device is also providing a solution to avoid heat spot problems of base cover, because the device doesn't contact with the base cover and no heat conduction between the CPU/fan and base cover is generated. Therefore this device dramatically improves thermal resistance of the fan-heat sink module without heatspot problems.

The structure of the device is shown in Fig.1. By connecting with the device by using screws, Fan-heat sink module is fastened on a card assembly. Heat generated by electric components is conducted to the device through the screws of the fan-heat sink module, and the heat is exhausted by the inhalation air. At this time, the device provides concentration of airflow in the direction of the fan intake, heat on the device gets cool effectively by the airflow, that is, total thermal resistance of the fan-heat sink module is decreased. At the same time, the device has the function to avoid heat spot problems of base cover. Since the fan-heat sink module is generally fastened on fan bosses of the base cover or enclosure, fan heat is conducted to the base cover through the...