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Environmentally Friendly HPCC Electronic Substrate and Method of Making Such Structure

IP.com Disclosure Number: IPCOM000016347D
Original Publication Date: 2002-Oct-30
Included in the Prior Art Database: 2003-Jun-21
Document File: 1 page(s) / 39K

Publishing Venue

IBM

Abstract

An electronic package is described where the core materials consist of ceramic filled Teflon and copper-invar-copper stabilizing layer and the top redistribution layers consist of a bromine free, laser ablatable dielectric material. Examples of such materials are LCP , (liquid crystal polymer) films , such as those manufactured and sold by Kuraray of Japan, or Hitachi MCF-4000G thermoset resin coated copper or a woven laser enhanced glass reinforced bromine free resin. The process for forming these bromine free HPCC structures differs slightly from the present processing due to the different processing attributes of the dielectric. 1

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  Environmentally Friendly HPCC Electronic Substrate and Method of Making Such Structure

    An electronic package is described where the core materials consist of ceramic filled Teflon and copper-invar-copper stabilizing layer and the top redistribution layers consist of a bromine free, laser ablatable dielectric material. Examples of such materials are LCP , (liquid crystal polymer) films , such as those manufactured and sold by Kuraray of Japan, or Hitachi MCF-4000G thermoset resin coated copper or a woven laser enhanced glass reinforced bromine free resin. The process for forming these bromine free HPCC structures differs slightly from the present processing due to the different processing attributes of the dielectric.

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