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Structures and Methods of creation planar structures in mixed density laminate structures

IP.com Disclosure Number: IPCOM000016348D
Original Publication Date: 2002-Oct-30
Included in the Prior Art Database: 2003-Jun-21
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Abstract

Following is a structure that allows a uniform PWB composite thru a design function of adding and subtraction copper per internal plane in non critical areas within each plane. This would allow for the overall reduction of overall thickness variations that currently occur with product that needs high density interconnection's in small area of the product. This will then allow for the Interposer to attach to the surface of the product with a improved planar surface.This would allow the designers to gain a flatter surface to connect non soldered lead interposers to the board surface.

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  Structures and Methods of creation planar structures in mixed density laminate structures

    Following is a structure that allows a uniform PWB composite thru a design function of adding and subtraction copper per internal plane in non critical areas within each plane. This would allow for the overall reduction of overall thickness variations that currently occur with product that needs high density interconnection's in small area of the product. This will then allow for the Interposer to attach to the surface of the product with a improved planar surface.This would allow the designers to gain a flatter surface to connect non soldered lead interposers to the board surface.

P roduct w ithout Im provem ents

P roduct w ith Im provem ents

Module

In te r p o s e r c a u s e tilt d u e to th e P W B having thickness issues in the im balance areas and possible creating interm itted opens

M odule

Interposer m ore flat and stable

Interposer

Fill

Im proved

A dded M aterial

1

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