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Serial Reading & Quasi Test Method by Single HGA Picking Up & Positioning

IP.com Disclosure Number: IPCOM000016375D
Original Publication Date: 2002-Nov-11
Included in the Prior Art Database: 2003-Jun-21
Document File: 3 page(s) / 125K

Publishing Venue

IBM

Abstract

Serial Reading Quasi Test Method by Single HGA Picking Up Positioning Serial Reading Quasi Test Method by Single HGA Picking Up Positioning 1. Method of Single HGA Picking Up Positioning HGAs to be tested are carried just under the pick up unit. HGAs are raised by the pick up unit to separate from the HGA tray. In this state, the serial number reading and the quasi test are performed.··(Fig.1) By separating from the HGA tray and performing the two measurements to the datum on space, mechanial tolerances that might be generated from the tray can be eliminated.

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Serial Reading & Quasi Test Method by Single HGA Picking Up & Positioning

Serial Reading & Quasi Test Method by Single HGA Picking Up & Positioning

1. Method of Single HGA Picking Up & Positioning

HGAs to be tested are carried just under the pick up unit. HGAs are raised by the pick up unit to separate from the HGA tray. In this state, the serial number reading and the quasi test are performed.··(Fig.1) By separating from the HGA tray and performing the two measurements to the datum on space, mechanial tolerances that might be generated from the tray can be eliminated.

Tray Table

Pick U p U nit

HGA Tray

Fig.1 The whole image of the machine system

2. Method of combined Serial Read and Quasi Test

Since the two measurements are integrated into one complete set of the tester, they can be related each other in measurement and characterized effectively.

3. Method of HGA positioning

The pick up unit consists of the vacuum pin, swage hole pin, mount plate pusher, upper core, and lower core. The vacuum pin, swage hole pin, and mount plate pusher are used for the serial reader, and the upper core,

and lower core are used for the quasi tester . (Fig.2) A HGA is sucked by the vacuum pin by turning on the vacuum, and aligned to the specified position by the contact (hard stop for the datum) between the mount plate pusher and the mount plate. The upper core goes down until a HGA is flattend out by the chip on core. The lower core goes up to form a specified clearance between the two cores. In this state, the serial reading and the quasi test are performed. (Fig.3)

1

HGA

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