Browse Prior Art Database

Spring-loaded Thermocouple to measure CPU Case Temperature

IP.com Disclosure Number: IPCOM000016400D
Original Publication Date: 2002-Nov-01
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 112K

Publishing Venue

IBM

Abstract

The Spring-loaded Thermocouple compresses when heatsink is secured to the CPU with a clip. This ensures that the heatsink is sitting flat on the CPU when temperature measurements are taken as shown in Figure 1. This is critical because heat exchange between CPU and heatsink depends on the area of contact and flatness. The design of the Spring-loaded Thermocouple is as shown in Figure 2. It has a M4 screw thread on the external surface and a spring-loaded ball bearing embedded with a thermocouple wire. The tip of the thermocouple is the point where temperature is being measured on the CPU. To mount the Spring-loaded Thermocouple, heatsink needs to be drilled with diameter 3.3mm and follow by a M4 tap.

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Spring-loaded Thermocouple to measure CPU Case Temperature

  The Spring-loaded Thermocouple compresses when heatsink is secured to the CPU with a clip. This ensures that the heatsink is sitting flat on the CPU when temperature measurements are taken as shown in Figure 1. This is critical because heat exchange between CPU and heatsink depends on the area of contact and flatness. The design of the Spring-loaded Thermocouple is as shown in Figure 2. It has a M4 screw thread on the external surface and a spring-loaded ball bearing embedded with a thermocouple wire. The tip of the thermocouple is the point where temperature is being measured on the CPU. To mount the Spring-loaded Thermocouple, heatsink needs to be drilled with diameter 3.3mm and follow by a M4 tap.

The advantages with this invention are:
1) Thermocouple is always in contact with the CPU surface
2) Achieve more accurate temperature measurement
3) Ease of installation

Current method is by drilling a hole into a heatsink and embedding thermocouple wire inside as shown in Figure 3. Excessive hole clearance will dislocate the thermocouple position during test. To solve this problem, the tip of the thermocouple is bend at an angle to 'grip' the sides of the hole. But this will cause the heatsink not sitting flat on the CPU as thermocouple will obstruct the installation. Occasionally, hot melt and thermal gel are needed to secure the thermocouple in position which is a messy and time-consuming process.

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