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Bias Springs Providing Mechanical Support for OSA Carrier Assemblies During Manufacture of Optical Transceivers.

IP.com Disclosure Number: IPCOM000016419D
Original Publication Date: 2002-Dec-13
Included in the Prior Art Database: 2003-Jun-21
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Abstract

A method and structure is provided to support OSA Carrier Assemblies during manufacture to prevent damage to the fragile electrical leads of the OSA's before they are attached to the printed circuit board. A flat, low profile leaf spring will be placed between the transceiver base and the bottom surface of the OSA Carriers. The spring is also used to set the correct height of the OSA heat slug against the top cover.

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  Bias Springs Providing Mechanical Support for OSA Carrier Assemblies During Manufacture of Optical Transceivers.

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OSA Spring Bias for ease of manufacture

and setting heat sink position.

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When spring (1) is installed it will provide force that will bias the OSA Carrier Assembly
(2) up and away from the printed circuit board (3), thereby protecting the OSA leads (4) during the pre-attachment alignment procedure. Once the leads are aligned over their respective solder pads, a force will be applied to the opposite side of the OSA, compressing the spring until the OSA heat slug (5) is set by contacting the outer top cover (6) . When the height is set and OSA Carrier is locked in place by the mounting flange (8) and screw (7) the spring will remain in place but have no further function.

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