Browse Prior Art Database

Method for Encapsulation of Interconnect Thru Mold Packages

IP.com Disclosure Number: IPCOM000016493D
Publication Date: 2003-Jun-25
Document File: 3 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a two-step process to encapsulate Interconnect Thru Mold (ITM) packages. Benefits include not adding any direct mechanical stresses to the package.

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Method for Encapsulation of Interconnect Thru Mold Packages

Disclosed is a method that uses a two-step process to encapsulate Interconnect Thru Mold (ITM) packages. Benefits include not adding any direct mechanical stresses to the package.

Background

Currently, encapsulation of the die in the bottom package is accomplished through a transfer mold process which entirely covers the solder balls directly mounted on the die.  The top part of the mold compound is removed through a grinding process that partially exposes the upper half of the solder balls to enable electrical interconnection between the lower package and the upper package. This process can lead to higher mechanical shear stresses on the package, de-lamination between the mold compound and the solder ball, and mechanical damage to the package itself.

General Description

The disclosed method uses a two-step process to encapsulate Interconnect Thru Mold (ITM) packages. In the first step, a high-viscosity encapsulating material forms a dam around the encapsulation area. In the second step, a low-viscosity material fills in the gaps around the solder balls, but partially exposes the upper areas for electrical interconnection.

The disclosed method is used to encapsulate the die in the bottom package of the ITM (see Figure 1 for detailed description of this package). Figures 2 and 3 show detailed descriptions of the current state of the art and the disclosed method, respectively.

Advantages

The invention does not add any direct mechanical...